Home News Intelligent Modules Market Drivers and challenges 2017 to 2021

Intelligent Modules Market Drivers and challenges 2017 to 2021

Intelligent Modules

Global Intelligent Modules Market Research Report 2017 to 2021 provides a unique tool for evaluating the market, highlighting opportunities, and supporting strategic and tactical decision-making. This report recognizes that in this rapidly-evolving and competitive environment, up-to-date marketing information is essential to monitor performance and make critical decisions for growth and profitability. It provides information on trends and developments, and focuses on markets and materials, capacities and technologies, and on the changing structure of the Intelligent Modules Market.

Companies Mentioned are ABB, Advantech Corporation, Bihl+Wiedemann, Rockwell Automation, and Siemens. Acromag, Beckhoff Automation, Eaton, Festo, GE, Mitsubishi Electric, OMRON, Turck Automation, WAGO, and Yokogawa.

The global Intelligent Modules market consists of different international, regional, and local vendors. The market competition is foreseen to grow higher with the rise in technological innovation and M&A activities in the future. Moreover, many local and regional vendors are offering specific application products for varied end-users. The new vendor entrants in the market are finding it hard to compete with the international vendors based on quality, reliability, and innovations in technology.

Major points covered in Global Intelligent Modules Market 2017 Research are:-

  • What will the market size and the growth rate be in 2021?
  • What are the key factors driving the global Intelligent Modules market?
  • What are the key market trends impacting the growth of the global Intelligent Modules market?
  • What are the challenges to market growth?
  • Who are the key vendors in the global Intelligent Modules market?
  • What are the market opportunities and threats faced by the vendors in the global Intelligent Modules market?
  • Trending factors influencing the market shares of the Americas, APAC, and EMEA.
  • What are the key outcomes of the five forces analysis of the global Intelligent Modules market?

This independent 77 page report guarantees you will remain better informed than your competition. With over 150 tables and figures examining the Intelligent Modules market, the report gives you a visual, one-stop breakdown of the leading products, submarkets and market leader’s market revenue forecasts as well as analysis to 2021.

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Geographically, this report is segmented into several key Regions, with production, consumption, revenue (million USD), and market share and growth rate of Intelligent Modules in these regions, from 2012 to 2021 (forecast), covering Americas, APAC and EMEA.

The report provides a basic overview of the Intelligent Modules industry including definitions, classifications, applications and industry chain structure. And development policies and plans are discussed as well as manufacturing processes and cost structures.

Then, the report focuses on global major leading industry players with information such as company profiles, product picture and specifications, sales, market share and contact information. What’s more, the Intelligent Modules industry development trends and marketing channels are analyzed.

Commenting on the report, an analyst from MIR’s team said: “The latest trend gaining momentum in the market is Wireless intelligent I/O modules with cloud connectivity. Wireless intelligent I/O modules are basically used for operation and control of field instruments. To ensure the ease of interoperability between field devices, the wireless intelligent I/O modules are equipped with high-speed data transfer standards of the Institute of Electrical and Electronics Engineers (IEEE) 802.11. A broad range of wireless intelligent I/O modules are used in discrete industries that follow developments of Industry 4.0. The specialty of wireless intelligent I/O modules is that these modules can be used without the need for the gateway and have their own microprocessors independent of the PLC’s microprocessor.”

According to the report, one of the major drivers for this market is Reduction in prices of raw materials. The major raw materials used in the manufacturing of intelligent I/O modules are copper windings, electrical steel, and insulation materials. All these materials constitute nearly 50% of the total manufacturing cost. Out of these, copper windings and electrical steel constitute 40% of the total intelligent I/O module cost. The decline in raw material costs results in lowering the manufacturing cost, thereby increasing the adoption of intelligent I/O modules in the end-user industries. The graph below shows the declining trend of raw material costs.

Further, the report states that one of the major factors hindering the growth of this market is Security concerns due to vulnerable I/O connections. The integration of industrial control systems, such as programmable logic controller (PLC), distributed control system (DCS), and supervisory control and data acquisition (SCADA), with business systems, such as enterprise resource planning (ERP) and customer relationship management (CRM), makes the system sensitive to cyber-attacks. Transmission control protocol/Internet protocol (TCP/IP) networking is the common protocol used to connect control systems and business systems. These systems are vulnerable to cyber-attacks due to vulnerable remote I/O connections, standardization of technologies, and easy availability of technical information over the Internet.

The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to a SWOT analysis of the key vendors.

The research includes historic data from 2012 to 2016 and forecasts until 2021 which makes the reports an invaluable resource for industry executives, marketing, sales and product managers, consultants, analysts, and other people looking for key industry data in readily accessible documents with clearly presented tables and graphs. The report will make detailed analysis mainly on above questions and in-depth research on the development environment, market size, development trend, operation situation and future development trend of Intelligent Modules on the basis of stating current situation of the industry in 2017 so as to make comprehensive organization and judgment on the competition situation and development trend of Intelligent Modules Market and assist manufacturers and investment organization to better grasp the development course of Intelligent Modules Market.

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